Method of performing a substrate detection process

ABSTRACT

A method of performing a substrate detection process is provided. The method includes emitting a signal to a surface of a substrate from an emitter disposed in a substrate storage container. The method also includes collecting the signal reflected from the surface of the substrate by a receiver disposed in the substrate storage container. The method further includes transmitting data corresponding to the collected signal to a signal processor. In addition, the method includes analyzing the data, and determining whether an action is to be performed on the substrate based on the analyzing.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 15/991,688, filed on May 29, 2018, the entirety of which isincorporated by reference herein.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (e.g., the number of interconnecteddevices per chip area) has generally increased while geometry size(e.g., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs.

Photolithography has been used to form components on a chip. As thedimensions of the integrated circuit components are reduced, thelithography process is required to transfer even smaller features onto asubstrate precisely, accurately, and without damage. Requirements forthe substrate flatness have generally become increasingly important forlithography resolution enhancement. The desire of the high resolutionlithography process has led to challenges that may not have beenpresented by previous generations at larger geometries.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 depicts a perspective view of a substrate storage container inaccordance with some embodiments;

FIG. 2 depicts schematically a load port of an apparatus in accordancewith some embodiments;

FIG. 3 depicts a cross sectional view of a substrate storage containerwith a substrate detecting system built therein in accordance with someembodiments;

FIG. 4A depicts a cross sectional view of a substrate storage containerwith a substrate detecting system built therein in accordance with someembodiments;

FIG. 4B depicts a schematic view of a base of the substrate storagecontainer of FIG. 4A in accordance with some embodiments;

FIG. 5A-5B depict examples of light beams from a substrate detectingsystem emitted to a substrate placed in a substrate storage container inaccordance with some embodiments;

FIG. 6 depicts an example of a base decking station disposed on a tableof a load port in accordance with some embodiments;

FIG. 7 depicts a bottom view of a substrate storage container inaccordance with some embodiments;

FIG. 8A depicts a cross sectional view of another example of a substratestorage container with a substrate detecting system built therein inaccordance with some embodiments;

FIG. 8B depicts a cross sectional view of another example of a substratestorage container with a rotatable substrate detecting system builttherein in accordance with some embodiments;

FIG. 8C depicts a cross sectional view of another example of a substratestorage container with a substrate detecting system built therein inaccordance with some embodiments;

FIG. 9A depicts a cross sectional view of a substrate storage containerwith a substrate detecting system built therein in accordance with someembodiments;

FIG. 9B depicts a schematic view of a base of the substrate storagecontainer of FIG. 9A in accordance with some embodiments;

FIG. 10A-10B depict a top view of a substrate detecting system inaccordance with some embodiments;

FIG. 11 depicts another example of a substrate storage container inaccordance with some embodiments; and

FIG. 12 depicts a flow chart for performing a substrate measurementprocess utilizing the substrate detecting system in the substratestorage container in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Generally, the present disclosure provides example embodiments relatingto a substrate detecting system disposed in a substrate storagecontainer. The substrate detecting system includes at least an emitterand a receiver that can measure the substrate surface conditions,profiles, topography, warpage, and flatness of the substrates storedand/or transferred in and out of a substrate storage container. Byutilizing the substrate detecting system embedded in the substratestorage container, the substrate surface conditions, profiles,topography, warpage, and/or flatness can be detected when the substratesare stored in the substrate storage container or transferred in and outof the substrate storage container. Thus, problematic substrates can bedetected earlier and remedial actions can be executed earlier for theproblematic substrates so as to save manufacturing cost and improvethroughput and cycle times.

FIG. 1 depicts a perspective view of a substrate storage container 102in accordance with some embodiments. The substrate storage container 102can store a plurality of semiconductor wafer substrates W (as shown inFIG. 2) therein. For example, a Front Opening Unified Pod (FOUP) is usedas the substrate storage container 102 to carry the substrates Wtherein. The substrate storage container 102 includes a sidewall body106 disposed on a base board 104 and below a lid 108 defining aninterior volume 110 where the substrates W are stored. A plurality ofslots 302 (shown in FIG. 3) is formed on the sidewall body 106 of thesubstrate storage container 102 so as to hold the substrates W in thesubstrate storage container 102 in desired positions. The sidewall body106 includes a front door 107 that may be removable from the substratestorage container 102 so as to permit the substrates W to be transferredin and out of the substrate storage container 102. The substrate storagecontainer 102 may have different dimensions to accommodate substrates Whaving different sizes to be positioned therein. For example, thesubstrate storage container 102 may have different dimensions to storesubstrates W having diameters of about 200 mm, 300 mm, or 450 mm.

A substrate detecting system 114 is positioned in the substrate storagecontainer 102. The substrate detecting system 114 includes at least anemitter 118 and a receiver 116. In the example depicted in FIG. 1, thesubstrate detecting system 114 is placed on or built in the base board104 of the substrate storage container 102. The emitter 118 provides abeam of light (e.g., a signal) to the substrates W in the substratestorage container 102. The beam of light reaches to a surface of thesubstrate W and is reflected back and collected by the receiver 116. Thesubstrate detecting system 114 is used for detecting various substrateconditions, including substrate surface profile, displacement of thesubstrate, or substrate flatness conditions. It is noted that thesubstrate detecting system 114 may be positioned in any suitablelocations in the substrate storage container 102 to facilitatemeasurement of the substrate conditions. Details of the substratedetecting system 114 will be further described below.

FIG. 2 depicts schematically a load port 202 of a processing apparatus250 in accordance with some embodiments. The load port 202 functions asan interface between the processing apparatus 250, such as in variousfabrication processes for manufacturing semiconductor devices on thesubstrate W. The load port 202 has a platform table 2 on which thesubstrate storage container 102 is to be mounted and placed. Theplatform table 2 has a base frame 22 which can mate with the base board104 of the substrate storage container 102. A port window 16 is on afront side of the load port 202 to receive the front door 107 of thesubstrate storage container 102. A port door 15 is disposed adjacent tothe port window 16 adapted to dock onto the front door 107 of thesubstrate storage container 102. Once the front door 107 is docked ontothe port window 16, the front door 107 may be unlocked and removed fromthe substrate storage container 102 so as to allow access of a substratehandler to the interior volume 110 of the substrate storage container102. The front door 107 may be removable from the substrate storagecontainer 102. The front door 107 may be moved in vertical or lateraldirections by the port door 15 to allow open communication between theinterior volume 110 of the substrate storage container 102 to the insideof the processing apparatus 250 onto which the load port 202 is hookedor docked.

In an example, the base board 104 is positioned on the base frame 22 ofthe platform table 2, and the base board 104 is movable by the platformtable 2 in a translation direction towards and away from the port window16 by a slider mechanism (not shown). Once the base board 104 is mountedonto the base frame 22, the substrate storage container 102 may be movedin a direction toward the port window 16 to a position where the portdoor 15 performs an operation to open and close the front door 107 toallow transfer of the substrates W into and out of the interior volume110 of the substrate storage container 102.

FIG. 3 depicts a perspective view of the substrate storage container 102with the substrate detecting system 114 disposed therein along. Theperspective view of FIG. 3 is along line A-A depicted in FIG. 2. Thesubstrates W are transferred into the interior volume 110 of thesubstrate storage container 102 by a substrate handler, such as a robot,and are placed in the slots 302 in the substrate storage container 102.Typically, the substrate storage container 102 includes multiple slots302 and each slot 302 holds one substrate. A slot 302 is open on oneside to allow a substrate to be removed. A slot establishes the positionof a substrate. The height of a substrate above the base board 104 ofthe substrate storage container 102 is established to allow a substrateto be picked without collision.

In the example depicted in FIG. 3, the substrate detecting system 114 ispositioned on the base board 104, e.g., a bottom portion, of thesubstrate storage container 102. As the emitter 118 is positioned toface a back surface of the substrate W, the beam of light 306 from theemitter 118 is emitted to the back surface of the substrate W while inoperation. The receiver 116 then collects the beam of light 308 (e.g.,the signal) reflected from the back surface of the substrate W. Theemitter 118 is positioned and/or oriented to view a zone or across thesurface of the substrate W, and the substrate detecting system 114 iscapable of sensing the surface conditions as well as the substrateflatness across or in certain zones of the substrate W.

In operation, the receiver 116 receives an indication of substrateconditions or substrate flatness (e.g., substrate warpage) from theemitter 118. The receiver 116 may be multi-wavelength detector, or aspectrometer. Based on the indication received from the reflected beamof light 308 from the receiver 116, a computing system (e.g., the signalprocessor 412 in FIGS. 4A-4B) calculates portions of the real-timewaveform and compares it with a stored characteristic waveform patternto extract information relating to the substrate conditions. A databaselibrary may be stored in a memory of the computing system or obtainedfrom another statistical process control (SPC) database stored in themanufacturing facility or from an electronic design automation (EDA)system. The data stored in the database library may be obtained fromhistorical values of substrate specifications and conditions from pastprocessing runs of standard values (e.g., a specification) of thesubstrates. Thus, the standard values (e.g., a specification) may bedetermined and selected from these historical values of substratemeasurements to best fit the substrate conditions after processes areperformed on the substrate. The calculation may be based on slopechanges or other characteristic changes in the detected signals, such asin reflection or transmission mode. In some embodiments, more detailedcalculations may be performed based on reflection data obtained over awide spectrum in order to determine the substrate surface condition, aswell as substrate flatness (e.g., substrate warpage).

Thus, after the received signals are analyzed and compared with thedatabase library, deviation and mismatched values/responses from thereceiver 116 may be found. Subsequently, a decision/action may be madeto correct, calibrate, terminate, re-work, or abandon the problematicsubstrates as needed. Early detection of the problematic substrates orabnormal substrates enables real-time action on the substrate W that hasdefects and/or substrate issues. Late detection or discovery of thedefects on the substrates may result in unnecessary and/or redundantprocess steps performed on the substrate that is eventually scrapped orabandoned. Thus, early detection of the defects formed on the substratemay eliminate or reduce manufacturing time/cycles performed on theproblematic substrate, thus saving manufacturing cost and improvingproduct yield. Furthermore, early detection of the defects may alsopermit early remedial steps to be performed on the substrate W so as totimely rework or re-process the substrate W to avoid unnecessary processsteps.

In the embodiment depicted in FIG. 3, the substrate detecting system 114is in operation to detect the substrate condition of the substrate Wpositioned in the substrate storage container 102. The substrate Wremains in a stationary state in this example while the emitter 118 maybe movable linearly or circularly as needed to obtain the information ormeasuring points on the substrate W.

FIG. 4A depicts a cross sectional view of the substrate storagecontainer 102 along line B-B. The substrate storage container 102 is inan open state that allows the substrate W to be transferred into and outof the substrate storage container 102. When the front door 107 isopened, a robot 403 can access the interior volume 110 of the substratestorage container 102 to retrieve the substrate W from the substratestorage container 102. While retrieving the substrate W from thesubstrate storage container 102, the robot 403 with a blade 402 (or anend effector) can extend to the space between the slots 302 where eachsubstrate W is located. Each slot 302 establishes the position of asubstrate so that the blade 402 may be inserted between the substrates Wwithout touching or scratching the substrates W. The blade 402 is thenlifted up to pick up the substrate W from the back surface of thesubstrate W. Additionally or alternatively, the substrate W may belowered onto the blade 402.

When the blade 402 moves the substrate W in a linear direction toretrieve the substrate W from the substrate storage container 102, theemitter 118 is activated to emit the beam of light 306 to scan thepredetermined measuring points/locations on the back surface of thesubstrate W. While scanning, the appearance, profile, surface conditionsas well as substrate flatness, e.g., warpage, may be predicted,calculated, and/or determined based on the reflected beam of light 308received by the receiver 116. Referring first to FIG. 5A, when a backsurface 602 of the substrate W has a particle 604 present, the beam oflight 308 reflected therefrom may be shifted, angled, or low inintensity, as shown in the dotted line 608, thus indicating anunexpected or a foreign object detected on the back surface 602 of thesubstrate W. Based on the received data points, a decision is then madeto determine if remedial processing is required, such as a backsidesurface cleaning process, backside polishing process, or furthersubstrate inspection process, for process quality control of thesubstrate in production line.

In another example depicted in FIG. 5B, when the emitter 118 isactivated, the reflected beam of light 608, 308 received by the receiver116 indicates warpage deviation (e.g., a height difference between afirst height 614 and a second height 613 located at different measuringpoints of the substrate W) relative to a horizontal plane 615.Quantities of displacement based on the warpage data deviation (e.g.,height difference between the first height 614 and the second height613) at the predetermined measuring points relative to the flatness ofthe desired horizontal plane 615 is then determined and computed. As theflatness of a substrate may significantly affect the resolution andalignment precision in a lithography process, a high level of flatnessof the substrate is generally desired to define a proper focal plane forthe lithography exposure process. Thus, based on the quantities ofdisplacement measured, the flatness of the substrate W is determined. Asa result, a decision can then made as to whether the flatness satisfiesa flatness standard value required for an accurate lithography exposureprocess. The flatness standard value is determined in advance based uponthe focal depth of the lithography optical apparatus. The flatnessstandard value may be stored in the data library in the computing system(such as the signal processor 412 in FIGS. 4A-4B). As depicted in FIG.5B, due to the curvature or warpage of the substrate W, the reflectedbeam of light 308, 608 measured at different measuring points indicatesvariations in height (e.g., height difference between the first height614 and the second height 613). Thus, the reflected beam of lights 308,608 detected by the receiver 116 indicates signals with differentintensities, and waveforms detected so that a computing or calculatingprocess may be performed to calculate the deformation/curvaturevariations of the substrate W.

Referring back to FIG. 4A, the substrate detecting system 114 ispositioned at a predetermined location in the substrate storagecontainer 102. In the example depicted in FIG. 4A, the substratedetecting system 114 is disposed on the base board 104, which forms abottom part of the substrate storage container 102.

FIG. 4B depicts a schematic view of the base board 104 of the substratestorage container 102. The base board 104 further includes a pluralityof components embedded therein to facilitate operation of the substratedetecting system 114. In some embodiment, the emitter 118 iscommunicatively coupled to a sensor controller 418. The sensorcontroller 418 is configured to control operation of the emitter 118.The sensor controller 418 may provide operating mechanisms for theemitter 118 to detect a condition, such as direction, inclination, oracceleration of the substrate W in at least X-Y directions when thesubstrate W is retrieved from the substrate storage container 102.

The sensor controller 418 is also in electrical communication with thereceiver 116. The sensor controller 418 is further configured to controlthe operation of the receiver 116. A motor 420 is coupled to the sensorcontroller 418. The motor 420 is further mechanically coupled to theemitter 118. Under control of the sensor controller 418, the motor 420is configured to rotate, spin, move, elevate, accelerate or lift theemitter 118 so as to provide a desired emitting angle to the substrate Wfor detection.

The motor 420 and the sensor controller 418, in some examples, arepowered by a battery 422. The battery 422 is further wired to a powerinput 424, which may be further connected to an electrical power source414 embedded in the base frame 22 in the load port 202 by cableconnection, direct conductive contact, or wireless communication whenthe substrate storage container 102 is docked on the base frame 22.Thus, the battery 422 is rechargeable when plugging into or by wirelesscommunication with the electrical power source 414 in the base frame 22through the power input 424, such as when the power level of the battery422 is low or consumed. It is noted that the battery 422 may also becharged wirelessly without plugging the substrate storage container 102into the electrical power source 414. For example, the battery 422 canbe charged wirelessly via inductive charging. It is noted that anadditional charging board may also be present to increase the inductivecharging rate.

When the substrate storage container 102 is placed on the base frame 22in the load port 202, the substrates W are then retrieved from thesubstrate storage container 102 for processing in the processingapparatus 250. Further, the battery 422 in the substrate storagecontainer 102 may be recharged by the electrical power source 414 in thebase frame 22. Thus, while the substrate storage container 102 is placedon the base frame 22 (e.g., during performance of the processes on thesubstrates W in the processing apparatus 250), the battery 422 isrecharged, thus efficiently utilizing wait time in the load port 202 forbattery charging.

In some examples, the battery 422 embedded in the base board 104 of thesubstrate storage container 102 provides the required power foroperation of the substrate detecting system 114 when the substratestorage container 102 is not connected to the electrical power source414. Thus, the substrate detecting system 114 may remain in operationeven during transportation of the substrate storage container 102 from afirst processing apparatus to a second processing apparatus in asemiconductor facility. By doing so, the substratedetection/inspection/measurement may be performed during thetransportation time. Thus, upon completion of the first process in thefirst processing apparatus and/or while the substrate storage container102 is being physically transported to the location where the secondprocessing apparatus is located, the substratedetection/inspection/measurement may be completed within the substratestorage container 102, and a determination can then be made whether toresume/continue the subsequent processes on the substrates W or pursueadditional remedial processing or rework on the substrates W. Thus, anextra step of metrology or substrate detection/measurement process maybe eliminated to improve process cycle time and manufacturing utilitytime by performing the substrate detection/measurement process in thesubstrate storage container 102.

In some examples, the sensor controller 418 is further coupled to asignal controller 416. The signal controller 416 controls the type ofsignals that may be transmitted to the sensor controller 418 so as toprovide a desired type of beam of light, signal, such as at a desiredwavelength, light intensity, or incident angle emitted from the emitter118. The signal controller 416 may be further communicatively coupled toa signal processor 412 in the base frame 22 by electrical contact orwireless communication. The signal processor 412 can provide a signalcommand and/or can process the signal (e.g., an electronic and/ordigital representation of the reflected beam of light 308) received fromthe receiver 116. After the signal is received, the signal processor 412analyzes, calculates, and compares the signal from the data library todetermine if any action is to be performed on the substrate.Additionally, the signal processor 412, after analysis, also can providean adjustment to the emitter 118 and/or to the receiver 116 to bettertrack, monitor, scan, detect and measure the condition of the substrateW. Thus, upon placing the substrate storage container 102 on the baseframe 22, data transmission is activated, unidirectional and/orbidirectional, between the signal processor 412 and the emitter 118and/or the receiver 116 so as to manage and control the substratemeasurement/detection process and to determine whether remedial actionsare to be performed on the problematic substrates, if necessary. In somecases, the data transmission is activated wirelessly without physicallyplacing the substrate storage container 102 on the base frame 22. Thus,the emitter 118 and/or the receiver 116 may be adjusted or altered basedon the data transmitted from the signal processor 412 wirelessly.

FIG. 6 depicts a front view of the load port 202 where the substratestorage container 102 is placed for transferring wafers from thesubstrate storage container 102 into the processing apparatus. The loadport 202 includes the base frame 22 on the platform table 2. A pluralityof positioning pins 502 is disposed on the base frame 22. Thepositioning pins 502 project above an upper surface of the base frame 22and are arranged to match with a plurality of positioning holes 702 on abottom surface of the base board 104 of the substrate storage container102, as shown in a bottom view of the base board 104 in FIG. 7. Thepositioning pins 502 and the positioning holes 702 allow the substratestorage container 102 to be precisely, securely, and repeatedlypositioned on the base frame 22 in the desired position. In theembodiment depicted herein, three positioning holes 702 are provided tomatch with the three positioning pins 502. It is noted that any numberof the positioning holes 702 and the positioning pins 502 may beimplemented in other examples. In some examples, the substrate storagecontainer 102 rests by gravity on the surface of the base frame 22.

The base frame 22 further includes multiple contact pads 504 configuredto contact with the contact pads 704 on the bottom surface of the baseboard 104 of the substrate storage container 102. The contact pads 504in the base frame 22 are further electrically coupled to the signalprocessor 412 and the electrical power source 414 embedded in the bodyof the base frame 22. The exposure of the contact pads 504 on thesurface of the base frame 22 allows an electrical connection with thecontact pads 704 on the base board 104 of the substrate storagecontainer 102. In some configurations, the signal processor 412 and theelectrical power source 414 may be further down in the platform table 2utilizing wires or cables to be in electrical communications with thecontact pads 504 on the surface of the base frame 22.

Similarly, the contact pads 704 on the bottom surface of the base board104 are further electrically coupled to the signal controller 416 andthe power input 424 embedded in the body of the base board 104 in thesubstrate storage container 102. Electrical or physical contact betweenthe contact pads 704, 504 allows electrical communication from thesignal controller 416 and the power input 424 to the signal processor412 and the electrical power source 414 respectively. In some examples,the signal controller 416 and the power input 424 can communicate withthe signal processor 412 and the electrical power source 414 wirelessly.It is noted that the dimensions of the contact pads 504, 704 may be inany suitable size as long as the contact pads 504, 704 can allow currentor electrical connection flowing therethrough from the signal controller416 and the power input 424 to the electrical power source 414 and thesignal processor 412, or vice versa.

FIGS. 8A-8C depicts different examples of the substrate detecting system114, 802 located at different locations of the substrate storagecontainer 102. The substrate detecting system 114, as shown in FIG. 8A,may be positioned on an edge of the substrate storage container 102.More specifically, the emitter 118 is positioned on the edge of the lid108, while the receiver 116 is positioned on the edge of the base board104. The emitter 118 positioned on the edge of the lid 108 may emit abeam of light to an edge of the substrate W so as to monitor the edgeparticles, edge residuals, and/or edge profile of the substrate. It isnoted that edge deposition may often occur from previous process stepsperformed on the substrate, which may result in substrate flatness andthickness deviation, which may adversely impact the focus resolutionduring a lithography process. Furthermore, edge deposition on thesubstrate can also result in particles where the end effector as therobot often grips the substrate edge, and thus, the end effector cancause chipping and scratching of the film materials accumulated on thesubstrate edge, which can result in causing a contamination source.Thus, monitoring/detecting of a state or profile of the substrate edgemay assist determining whether processing performed on the substratecaused substrate edge film accumulation to be present, and if so, mayassist determining whether remedial processing should be performed toprevent additional particle generation. Although the example depicted inFIG. 8A shows that the emitter 118 is located on the lid 108 and thereceiver 116 is located on the base board 104, it is noted that theposition of the emitter 118 and the receiver 116 may be switched or inother suitable positions.

In other examples, the substrate detecting system 114 is located andinstalled on the lid 108 of the substrate storage container 102 todetect a front surface condition of the substrate, as shown in FIG. 8B.

FIG. 8C depicts a substrate detecting system 802 including a rotatableemitter 804 utilized with a receiver 806. As the emitter 804 isrotatable, the measuring points on the substrate may be increased andselected across different locations of the substrate to promote theaccuracy of the substrate profile prediction.

FIG. 9A depicts another example of a substrate detecting system 902 thatincludes an image sensor 904. The image sensor 904 may be acharged-coupled device (CCD) or a complementarymetal-oxide-semiconductor (CMOS) image sensor. The image sensor 904 iscontrolled by the sensor controller 906 embedded in the base frame 22,as further depicted in FIG. 9B. The sensor controller 906 is furtherconnected to a motor 420 and a battery 422. The motor 420, based on thecontrol of the sensor controller 906, controls the movement of the imagesensor 904. The battery 422 may be recharged by the electrical powersource 414 through the power input 424 in the similar fashion asdescribed above with referenced to FIG. 4B.

The image sensor 904 includes a camera that can capture an image of thesubstrate surface. The image sensor 904 is further coupled to a signalprocessor 910 through a signal controller 908. The image sensor 904provides the signal processor 910 with a data signal defining an imageon based on the signals, e.g., beam of light, received by the imagesensor 904, and the signal processor 910 processes the signal suppliedfrom the image sensor 904. The data signal is then transmitted to thesignal processor 910 for further analysis and is compared with imagesstored in the data library so as to determine if an action is requiredto be performed on the substrate W for process quality management andcontrol.

FIGS. 10A-10B depict top views of the emitter 118. The emitter 118includes a plurality of light sources 1004 on a supporting base 1006.The light sources 1004 emit the beam of light at a desired wavelength,such as from 150 nm to 2000 nm. The plurality of light sources 1004 hasa first width 1008 that can emit a beam of light to different measuringpoints across the substrate. In the examples wherein the substrate has asmaller dimension, a shield 1002 that is moveable and trackable is usedto adjust and reduce a width through which beams of light from the lightsource 1004 are emitted to the substrate. As illustrated, the shield1002 can reduce the first width 1008 to a second width 1010. The reducedsecond width 1010 can accommodate the smaller dimension of a substrateto provide beams of light to the desired measuring locations on thesubstrate without undesired reflection.

FIG. 11 depicts an exploded view of another example of a substratestorage container 1102. The substrate storage container 1102 includes alid 1104, a bottom 1106, and a sidewall body (not shown) disposedbetween. The lid 1104, bottom 1106, and sidewall body together define aninterior volume that allows a photomask reticle 1108 to be storedtherein. The photomask reticle 1108 has a rectangular shape having sidesbetween about 5 inches to about 9 inches in length. The photomaskreticle 1108 may be between about 0.15 inches and about 0.25 inchesthick. The photomask reticle 1108 typically includes an opticallytransparent silicon based material, such as quartz or low thermalexpansion glass layer, having a film stack disposed thereon with desiredfeatures formed therein. The desired features formed in the film stackof the photomask reticle 1108 can be used to transfer features toanother target substrate in a lithography process. Similar to theconfiguration of the substrate storage container 102 discussed above,the substrate storage container 1102 includes a substrate detectingsystem 1110 disposed therein. The substrate detecting system 1110includes an emitter 1116 and a receiver 1118 disposed on the lid 1104and the bottom 1106, respectively. It is noted that the positions of theemitter 1116 and the receiver 1118 may be changed or altered. As thephotomask reticle 1108 is optically transparent, the emitter 1116 andthe receiver 1118 disposed at opposite sides may utilize a lighttransmission mode to transmit the beam of light through the photomaskreticle 1108. The description regarding the operation of the substratedetecting system 1110, data transmission, data processing, data analysisand the power backup or power charging is similarly constructed as thesubstrate storage container 102 described above and is eliminated hereinfor sake of brevity.

FIG. 12 depicts a flow chart for a substrate measurement process 1200utilizing the substrate detecting system 114 built in the substratestorage container 102 in accordance with some embodiments. The substratestorage container 102 includes a substrate W in the substrate storagecontainer 102. It is noted that more than one substrate W may beprovided in the substrate storage container 102 as needed.

At operation 1202, a signal (e.g., the beam of light 306) is thenemitted from the emitter 118 to the surface 602 of the substrate W. Atoperation 1204, the reflected signal (e.g., the reflected beam of light308, 606, 608) is then collected by the receiver 116. At operation 1206,the collected signal is then transmitted to the signal processor 412,910 for analysis so as to determine of a remedial action is required tobe performed on the substrate W.

Embodiments described herein provide a substrate detecting systemdisposed in a substrate storage container. As the substrate storagecontainer is portable, the substrate detecting system disposed in thesubstrate storage container can perform a substratemeasurement/inspection process at any time in the production line when asubstrate is present in the substrate storage container. The substratemeasurement/inspection process can measure the substrate surfaceconditions, profiles, topography, warpage, and/or flatness of thesubstrates stored and/or transferred in and out of a substrate storagecontainer. By utilizing the substrate detecting system embedded in thesubstrate storage container, the substrate surface conditions, profiles,topography, warpage, and/or flatness can be detected when the substratesare stored in the substrate storage container or transferred in and outof the substrate storage container. Thus, problematic substrates can bedetected earlier during fabrication, and remedial actions can beexecuted earlier during fabrication on the problematic substrates so asto save manufacturing cost and improve throughput and cycle times.

In an embodiment, a method of performing a substrate detection processincludes emitting a signal to a surface of a substrate from an emitterdisposed in a substrate storage container, collecting the signalreflected from the surface of the substrate by a receiver disposed inthe substrate storage container, transmitting data corresponding to thecollected signal to a signal processor, analyzing the data, anddetermining whether an action is to be performed on the substrate basedon the analyzing.

In an embodiment, the data is transmitted to the signal processorwirelessly.

In an embodiment, the data is transmitted to the signal processor byelectrically connecting the receiver to the signal processor disposed ina base frame of a load port in a processing apparatus.

In an embodiment, emitting the signal further includes rotating orcontrolling a movement of the emitter by a motor disposed in thesubstrate storage container.

In an embodiment, the emitter is rotatable relative to the receiver.

In an embodiment, the emitter and the receiver are powered by a batterydisposed in the substrate storage container.

In an embodiment, the emitter and the receiver are positioned facing thesurface of the substrate.

In an embodiment, the emitter and the receiver are positioned on a baseboard of the substrate storage container.

In an embodiment, the emitter and the receiver are positioned facingopposite surfaces of the substrate.

In an embodiment, emitting the signal further includes emitting a beamof light, and adjusting a width of the beam of light via a shield.

In another embodiment, a method of performing a substrate detectionprocess includes: placing a substrate storage container on a load port,matching a plurality of positioning holes on a base board of thesubstrate storage container with a plurality of positioning pins on theload port, emitting a signal to a surface of a substrate from an emitterdisposed on the base board, and collecting the signal reflected from thesurface of the substrate by a receiver disposed on the base board.

In an embodiment, the method further includes: transmitting datacorresponding to the collected signal to a signal processor, analyzingthe data, and determining whether an action is to be performed on thesubstrate based on the analyzing.

In an embodiment, the data is transmitted to the signal processorwirelessly.

In an embodiment, the method further includes: receiving the substratein one of the plurality of slots formed in a sidewall body of thesubstrate storage container.

In an embodiment, emitting the signal further includes: rotating orcontrolling a movement of the emitter by a motor disposed in thesubstrate storage container.

In an embodiment, the method further includes: powering the motor by abattery embedded in the base board.

In an embodiment, the battery is rechargeable wirelessly via inductivecharging.

In yet another embodiment, a method of performing a substrate detectionprocess includes: emitting a signal to a surface of a substrate from anemitter disposed in a substrate storage container, collecting the signalreflected from the surface of the substrate by a receiver disposed inthe substrate storage container, and rotating the emitter relative tothe receiver to select measuring points on the substrate.

In an embodiment, the method further includes: transmitting datacorresponding to the collected signal to a signal processor, analyzingthe data, and determining whether an action is to be performed on thesubstrate based on the analyzing.

In an embodiment, the data is transmitted to the signal processorwirelessly.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of performing a substrate detectionprocess, the method comprising: emitting a signal to a surface of asubstrate from an emitter disposed in a substrate storage container;collecting the signal reflected from the surface of the substrate by areceiver disposed in the substrate storage container; transmitting datacorresponding to the collected signal to a signal processor; analyzingthe data; and determining whether an action is to be performed on thesubstrate based on the analyzing.
 2. The method of claim 1, wherein thedata is transmitted to the signal processor wirelessly.
 3. The method ofclaim 1, wherein the data is transmitted to the signal processor byelectrically connecting the receiver to the signal processor disposed ina base frame of a load port in a processing apparatus.
 4. The method ofclaim 1, wherein emitting the signal further comprises: rotating orcontrolling a movement of the emitter by a motor disposed in thesubstrate storage container.
 5. The method of claim 4, wherein theemitter is rotatable relative to the receiver.
 6. The method of claim 1,wherein the emitter and the receiver are powered by a battery disposedin the substrate storage container.
 7. The method of claim 1, whereinthe emitter and the receiver are positioned facing the surface of thesubstrate.
 8. The method of claim 7, wherein the emitter and thereceiver are positioned on a base board of the substrate storagecontainer.
 9. The method of claim 1, wherein the emitter and thereceiver are positioned facing opposite surfaces of the substrate. 10.The method of claim 1, wherein emitting the signal further comprises:emitting a beam of light; and adjusting a width of the beam of light viaa shield.
 11. A method of performing a substrate detection process, themethod comprising: placing a substrate storage container on a load port;matching a plurality of positioning holes on a base board of thesubstrate storage container with a plurality of positioning pins on theload port; emitting a signal to a surface of a substrate from an emitterdisposed on the base board; and collecting the signal reflected from thesurface of the substrate by a receiver disposed on the base board. 12.The method of claim 11, further comprising: transmitting datacorresponding to the collected signal to a signal processor; analyzingthe data; and determining whether an action is to be performed on thesubstrate based on the analyzing.
 13. The method of claim 12, whereinthe data is transmitted to the signal processor wirelessly.
 14. Themethod of claim 11, further comprising: receiving the substrate in oneof the plurality of slots formed in a sidewall body of the substratestorage container.
 15. The method of claim 11, wherein emitting thesignal further comprises: rotating or controlling a movement of theemitter by a motor disposed in the substrate storage container.
 16. Themethod of claim 15, further comprising: powering the motor by a batteryembedded in the base board.
 17. The method of claim 16, wherein thebattery is rechargeable wirelessly via inductive charging.
 18. A methodof performing a substrate detection process, the method comprising:emitting a signal to a surface of a substrate from an emitter disposedin a substrate storage container; collecting the signal reflected fromthe surface of the substrate by a receiver disposed in the substratestorage container; and rotating the emitter relative to the receiver toselect measuring points on the substrate.
 19. The method of claim 18,further comprising: transmitting data corresponding to the collectedsignal to a signal processor; analyzing the data; and determiningwhether an action is to be performed on the substrate based on theanalyzing.
 20. The method of claim 18, wherein the data is transmittedto the signal processor wirelessly.